<?xml version="1.0" encoding="UTF-8"?><?xml-stylesheet href="https://news.x4a.net/wp-content/plugins/pretty-rss-feeds/xslt/pretty-feed.xsl" type="text/xsl" media="screen" ?><rss version="2.0"
	xmlns:content="http://purl.org/rss/1.0/modules/content/"
	xmlns:wfw="http://wellformedweb.org/CommentAPI/"
	xmlns:dc="http://purl.org/dc/elements/1.1/"
	xmlns:atom="http://www.w3.org/2005/Atom"
	xmlns:sy="http://purl.org/rss/1.0/modules/syndication/"
	xmlns:slash="http://purl.org/rss/1.0/modules/slash/"
	>

<channel>
	<title>TER</title>
	<atom:link href="https://news.x4a.net/ticker/ter/feed/" rel="self" type="application/rss+xml" />
	<link>https://news.x4a.net</link>
	<description></description>
	<lastBuildDate>Wed, 21 Oct 2026 12:41:54 +0000</lastBuildDate>
	<language>en-US</language>
	<sy:updatePeriod>
	hourly	</sy:updatePeriod>
	<sy:updateFrequency>
	1	</sy:updateFrequency>
	
	<item>
		<title>Teradyne Robotics and Sereact Partner to Scale Physical AI Solutions for Retail and Log&#8230;</title>
		<link>https://news.x4a.net/marketwire/teradyne-robotics-and-sereact-partner-to-scale-physical-ai-solutions-for-retail-and-log/</link>
		
		<dc:creator><![CDATA[X4A MarketWire]]></dc:creator>
		<pubDate>Wed, 21 Oct 2026 12:41:54 +0000</pubDate>
				<guid isPermaLink="false">https://news.x4a.net/marketwire/teradyne-robotics-and-sereact-partner-to-scale-physical-ai-solutions-for-retail-and-log/</guid>

					<description><![CDATA[Teradyne Robotics and Sereact Partner to Scale Physical AI Solutions for Retail and Logistics Partnership pairs Sereact&#8217;s physical AI platform with collaborative industrial robots from Universal Robots (UR) to bring intelligent, adaptable automation to real-world operations previously hard to automate, such as the processing of returned fashion items. &#124; $TER]]></description>
										<content:encoded><![CDATA[<p>Teradyne Robotics and Sereact Partner to Scale Physical AI Solutions for Retail and Logistics</p>
<p>Partnership pairs Sereact&#8217;s physical AI platform with collaborative industrial robots from Universal Robots (UR) to bring intelligent, adaptable automation to real-world operations previously hard to automate, such as the processing of returned fashion items. | $TER</p>
]]></content:encoded>
					
		
		
			</item>
		<item>
		<title>Teradyne to Announce Third Quarter 2026 Results &#124; $TER</title>
		<link>https://news.x4a.net/marketwire/teradyne-to-announce-third-quarter-2026-results-ter/</link>
		
		<dc:creator><![CDATA[X4A MarketWire]]></dc:creator>
		<pubDate>Wed, 14 Oct 2026 06:52:35 +0000</pubDate>
				<guid isPermaLink="false">https://news.x4a.net/marketwire/teradyne-to-announce-third-quarter-2026-results-ter/</guid>

					<description><![CDATA[Teradyne to Announce Third Quarter 2026 Results &#124; $TER]]></description>
										<content:encoded><![CDATA[<p>Teradyne to Announce Third Quarter 2026 Results | $TER</p>
]]></content:encoded>
					
		
		
			</item>
		<item>
		<title>FormFactor and Teradyne Announce Strategic Collaboration to Accelerate Next-Generation &#8230;</title>
		<link>https://news.x4a.net/marketwire/formfactor-and-teradyne-announce-strategic-collaboration-to-accelerate-next-generation/</link>
		
		<dc:creator><![CDATA[X4A MarketWire]]></dc:creator>
		<pubDate>Mon, 12 Oct 2026 20:01:35 +0000</pubDate>
				<guid isPermaLink="false">https://news.x4a.net/?post_type=x4a_wire&#038;p=272</guid>

					<description><![CDATA[FormFactor and Teradyne Announce Strategic Collaboration to Accelerate Next-Generation Semiconductor Testing Companies to combine leadership in probe, interface, and test technologies to accelerate AI and high-performance compute deployments &#124; $FORM $TER]]></description>
										<content:encoded><![CDATA[<p>FormFactor and Teradyne Announce Strategic Collaboration to Accelerate Next-Generation Semiconductor Testing</p>
<p>Companies to combine leadership in probe, interface, and test technologies to accelerate AI and high-performance compute deployments | $FORM $TER</p>
]]></content:encoded>
					
		
		
			</item>
		<item>
		<title>Teradyne Introduces UltraFLEXplus S Series for Edge AI Applications</title>
		<link>https://news.x4a.net/marketwire/teradyne-introduces-ultraflexplus-s-series-for-edge-ai-applications/</link>
		
		<dc:creator><![CDATA[X4A MarketWire]]></dc:creator>
		<pubDate>Mon, 12 Oct 2026 14:07:24 +0000</pubDate>
				<guid isPermaLink="false">https://news.x4a.net/marketwire/teradyne-introduces-ultraflexplus-s-series-for-edge-ai-applications/</guid>

					<description><![CDATA[Teradyne Introduces UltraFLEXplus S Series for Edge AI Applications New Series of Testers Extend the UltraFLEXplus Architecture to Deliver Superior Floor Space Economics for High-Mix, Variable-Volume Manufacturing &#124; $TER]]></description>
										<content:encoded><![CDATA[<p>Teradyne Introduces UltraFLEXplus S Series for Edge AI Applications</p>
<p>New Series of Testers Extend the UltraFLEXplus Architecture to Deliver Superior Floor Space Economics for High-Mix, Variable-Volume Manufacturing | $TER</p>
]]></content:encoded>
					
		
		
			</item>
		<item>
		<title>Teradyne Introduces Titan HP Platform with Burn-In Capabilities for Advanced AI Data Ce&#8230;</title>
		<link>https://news.x4a.net/marketwire/teradyne-introduces-titan-hp-platform-with-burn-in-capabilities-for-advanced-ai-data-ce/</link>
		
		<dc:creator><![CDATA[X4A MarketWire]]></dc:creator>
		<pubDate>Tue, 06 Oct 2026 13:06:46 +0000</pubDate>
				<guid isPermaLink="false">https://news.x4a.net/marketwire/teradyne-introduces-titan-hp-platform-with-burn-in-capabilities-for-advanced-ai-data-ce/</guid>

					<description><![CDATA[Teradyne Introduces Titan HP Platform with Burn-In Capabilities for Advanced AI Data Center Devices Chipmakers can lower cost of test, factory floor space, and time to market for high-power AI, automotive, and other high-reliability devices. &#124; $TER]]></description>
										<content:encoded><![CDATA[<p>Teradyne Introduces Titan HP Platform with Burn-In Capabilities for Advanced AI Data Center Devices</p>
<p>Chipmakers can lower cost of test, factory floor space, and time to market for high-power AI, automotive, and other high-reliability devices. | $TER</p>
]]></content:encoded>
					
		
		
			</item>
		<item>
		<title>Teradyne Announces Magnum E2 to Address Next-Generation Memory Test Demands Driven by A&#8230;</title>
		<link>https://news.x4a.net/marketwire/teradyne-announces-magnum-e2-to-address-next-generation-memory-test-demands-driven-by-a/</link>
		
		<dc:creator><![CDATA[X4A MarketWire]]></dc:creator>
		<pubDate>Tue, 29 Sep 2026 08:10:23 +0000</pubDate>
				<guid isPermaLink="false">https://news.x4a.net/?post_type=x4a_wire&#038;p=72</guid>

					<description><![CDATA[Teradyne Announces Magnum E2 to Address Next-Generation Memory Test Demands Driven by AI and High-Performance Computing Advanced Near-DUT architecture delivers superior high-speed signal integrity, high parallelism, and a scalable and flexible test foundation for next-generation DRAM and NAND innovations. &#124; $TER]]></description>
										<content:encoded><![CDATA[<p>Teradyne Announces Magnum E2 to Address Next-Generation Memory Test Demands Driven by AI and High-Performance Computing<br />
Advanced Near-DUT architecture delivers superior high-speed signal integrity, high parallelism, and a scalable and flexible test foundation for next-generation DRAM and NAND innovations. | $TER</p>
]]></content:encoded>
					
		
		
			</item>
	</channel>
</rss>
