Applied Materials and Intel Collaborate to Accelerate Chipmaking Innovations for AI-Driven Computing
Collaborations at Applied’s EPIC Center in Silicon Valley and Intel’s R&D campus in Oregon aim to develop breakthroughs in next-generation transistors, interconnects and advanced packaging technologies for AI chips and systems
Collaboration builds on the companies’ long history of working together to solve complex semiconductor device scaling challenges | $AMAT $INTC
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